Overview

Silicon Motion Leverages the industry leading technologies and experiences in NAND flash memory controller along with Multi-Chip Package (MCP) solution to introduce Ferri Family, including FerriSSD®, Ferri-eMMC® and Ferri-UFS®.
 

Ferri-eMMC®

Industrial / Automotive eMMC Memory

Ferri-eMMC®is optimally designed for a wide range of embedded applications and is fully compliant to the JEDEC standards for eMMC* 4.5/5.0/5.1 protocols. Available in 100/153-ball BGA packages, Ferri-eMMC® eases PCB design and enables low-cost manufacturing.

Built with industry-proven controllers and high-quality NAND components, Ferri-eMMC® offers advanced NAND management features including error correction, bad block management, and health monitoring – enabling the most highly reliable, non-volatile eMMC storage solution for today's cutting-edge industrial, embedded and automotive applications. For automotive IVI applications, Ferri-eMMC® features industry-leading low dppm, AEC-Q100 grade 3/2 qualification, and product longevity support.

Embedded applications using HDD or raw NAND today can migrate to Ferri-eMMC® for higher performance and capacity options. Additionally, Ferri-eMMC® can be customized via firmware for specific features and applications.

As the world's leading NAND controller vendor, Silicon Motion builds its products to the highest quality and reliability standards – backed by uncompromised sales and technical support from design through post-production. Silicon Motion's commitment to automotive and industrial quality is fully incorporated throughout the design, manufacturing, and qualification phases of its Ferri-eMMC® products.

Ferri-eMMC® with the NXP's i.MX93 EVK –
A Leading Automotive Platform


Ferri Family Enabling the NAND Flash Storage in Comprehensive Applications

Features

High-Efficiency Error Correction
  • Advanced Hardware BCH Error Correcting Code (ECC) Engine
  • StaticDataRefresh™ and EarlyRetirement™ technologies ensure the data reliability
Advanced Global Wear Leveling to Enhance Reliability
  • Even distribution of program / erase cycles across all NAND flash chips
  • Maximizes the lifespan with a low Write Amplification Index (WAI)
Robust Data Protection
  • Advanced system-level protection against unstable power
  • Software/hardware write protect option
  • Multiple user data security zones
  • Software/hardware secure erase function
  • PowerShield™ and DataPhoenix™ technologies prevent data corruption in case of sudden power lost

Technologies

IntelligentScan™ and DataRefresh™ to Enhance Data Retention in High Temperature Environment

Silicon Motion's proprietary IntelligentScan function will activate automatically to scan recharge, repair or retire the cell block (DataRefresh™) according to the host behavior and working environment (eg. ambient temperature). As a result of the combination of IntelligentScan™ and DataRefresh™, Ferri-eMMC® can effective prolong its service life much beyond typical NAND specifications.

Application

icon-Automotive   Automotive
icon-Sever   Sever
icon-Thin-Client   Thin Client
icon-Medical-Device   Medical Device
icon-POS   POS
icon-Kiosk   Kiosk
icon-Gaming   Gaming
icon-Surveillance   Surveillance
icon-Multifunction-Printer   Multifunction Printer
icon-Factory-Automation/HMI Factory   Automation/HMI
icon-Industrial-Handheld-Device   Industrial Handheld Device
icon-Test-Instruments   Test Instruments
Driving Automotive Innovation
Learn More

Selection Guide

File Product Interface Capacity Flash Type Temp. Range Part Status Note
SM662GXC-BFS eMMC 5.1 100-b 64GB 3D TLC NAND C-temp: -25℃to 85℃ MP
SM662GXD-BFS eMMC 5.1 100-b 128GB 3D TLC NAND C-temp: -25℃to 85℃ MP
SM662GXE-BFS eMMC 5.1 100-b 256GB 3D TLC NAND C-temp: -25℃to 85℃ MP
SM662GXF-BFS eMMC 5.1 100-b 512GB 3D TLC NAND C-temp: -25℃to 85℃ MP
SM662GEC-BFS eMMC 5.1 100-b 64GB 3D TLC NAND i-temp: -40℃to 85℃ MP
SM662GED-BFS eMMC 5.1 100-b 128GB 3D TLC NAND i-temp: -40℃to 85℃ MP
SM662GEE-BFS eMMC 5.1 100-b 256GB 3D TLC NAND i-temp: -40℃to 85℃ MP
SM662GEF-BFS eMMC 5.1 100-b 512GB 3D TLC NAND i-temp: -40℃to 85℃ MP
SM662GAC-BFS eMMC 5.1 100-b 64GB 3D TLC NAND Auto-grade3: -40℃ to 85℃ MP
SM662GAD-BFS eMMC 5.1 100-b 128GB 3D TLC NAND Auto-grade3: -40℃ to 85℃ MP
SM662GAE-BFS eMMC 5.1 100-b 256GB 3D TLC NAND Auto-grade3: -40℃ to 85℃ MP
SM662GAF-BFS eMMC 5.1 100-b 512GB 3D TLC NAND Auto-grade3: -40℃ to 85℃ MP
SM662GBC-BFS eMMC 5.1 100-b 64GB 3D TLC NAND Auto-grade2: -40℃ to 105℃ MP
SM662GBD-BFS eMMC 5.1 100-b 128GB 3D TLC NAND Auto-grade2: -40℃ to 105℃ MP
SM662GBE-BFS eMMC 5.1 100-b 256GB 3D TLC NAND Auto-grade2: -40℃ to 105℃ MP
SM662GBF-BFS eMMC 5.1 100-b 512GB 3D TLC NAND Auto-grade2: -40℃ to 105℃ MP
SM662PXC-BFS eMMC 5.1 153-b 64GB 3D TLC NAND C-temp: -25℃to 85℃ MP
SM662PXD-BFS eMMC 5.1 153-b 128GB 3D TLC NAND C-temp: -25℃to 85℃ MP
SM662PXE-BFS eMMC 5.1 153-b 256GB 3D TLC NAND C-temp: -25℃to 85℃ MP
SM662PXF-BFS eMMC 5.1 153-b 512GB 3D TLC NAND C-temp: -25℃to 85℃ MP
SM662PEC-BFS eMMC 5.1 153-b 64GB 3D TLC NAND i-temp: -40℃to 85℃ MP
SM662PED-BFS eMMC 5.1 153-b 128GB 3D TLC NAND i-temp: -40℃to 85℃ MP
SM662PEE-BFS eMMC 5.1 153-b 256GB 3D TLC NAND i-temp: -40℃to 85℃ MP
SM662PEF-BFS eMMC 5.1 153-b 512GB 3D TLC NAND i-temp: -40℃to 85℃ MP
SM662PAC-BFS eMMC 5.1 153-b 64GB 3D TLC NAND Auto-grade3: -40℃ to 85℃ MP
SM662PAD-BFS eMMC 5.1 153-b 128GB 3D TLC NAND Auto-grade3: -40℃ to 85℃ MP
SM662PAE-BFS eMMC 5.1 153-b 256GB 3D TLC NAND Auto-grade3: -40℃ to 85℃ MP
SM662PAF-BFS eMMC 5.1 153-b 512GB 3D TLC NAND Auto-grade3: -40℃ to 85℃ MP
SM662PBC-BFS eMMC 5.1 153-b 64GB 3D TLC NAND Auto-grade2: -40℃ to 105℃ MP
SM662PBD-BFS eMMC 5.1 153-b 128GB 3D TLC NAND Auto-grade2: -40℃ to 105℃ MP
SM662PBE-BFS eMMC 5.1 153-b 256GB 3D TLC NAND Auto-grade2: -40℃ to 105℃ MP
SM662PBF-BFS eMMC 5.1 153-b 512GB 3D TLC NAND Auto-grade2: -40℃ to 105℃ MP